Fives Lund shared a development partnership with a pair of semiconductor companies for over 20 years. During this time, Lund contributed to the development of several key process technologies for semiconductor wafer processing.

These include:

  • Electroplating

  • Backside Film Etch

  • Copper Backside Etch and Bevel Etch

  • Supercritical 5000 psi CO2 Processing (300mm Wafer)

  • Container Dry and Clean

  • Wafer Clean (Single and Multi-Wafer)

  • Thermal Processing Furnaces

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